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Semiconductor Packaging Solutions µMaxPak Documents

µMaxPaks are Near Chip-Scale SMD packages for power GaN & SiC devices. They virtually eliminate package parasitics & thermal resistance (Rjc), enabling power WBG device's full performance, efficiency & power density. They allow pre-test & pre-yielding before system assembly. These documents clarify the WBG µMaxPak details that explains why power module replacement be inevitable for Industrial, EV & Locomotive applications. 

1. Semiconductor Packaging Solutions 2020 µMaxPak Newsletter

Newsletter outlines 2019 successful effort to scale the µMaxPak packaging technology to higher voltages and currents.

2. µMaxPak Scalability to EV & Locomotive Traction, Bodo's Power System February 2020 Issue

Published article detailing the high power levels, the performance, the be nefits, and the development needed to reach those levels.

3. Near Chip-Scale Inevitability for Power WBG Packaging, Bodo's Power System July 2019 Issue

Published article answering questions that inquirers have asked ask the inventor since the µMaxPak technology's introduction  

4. µMaxPak 2018 Synopsis

A summary of the basic µMaxPak technology citing semiconductor switch assembly variations and their advantages 

5. 2016 APEC Presentation

A detailed presentation that introduced the µMaxPak to the power electronics industry at APEC 2016 

6. US009214416-µMaxPak121515

The basic µMaxPak technology Patent 

7. µMaxPak Inventor's Biography

Inventor shares his experience product packaging designing, process designing, and manufacturing that led to his combining Power QFN and high current module designs to create the µMaxPak packaging technology.

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